CS²B
Now deploying production AI agents

We build AI agents
that work in production.

We help enterprises design, build, and operate multi-agent AI systems — from RAG pipelines to protocol integrations — with the observability and guardrails required for real-world deployment.

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FULL STACK ARCHITECTURE

From Application to Silicon

Ten layers of abstraction between your question and the transistors that answer it. Click any layer to explore.

Agentic AI — Full Stack Architecture

From Application to Silicon

L9
APPLICATION
User-Facing Applications
Chat interfaces, dashboards, workflow automations, decision support systems. Where humans interact with agents.
React / Next.js REST / GraphQL / gRPC WebSocket Streaming Voice (sub-100ms)
Latency target < 200ms E2E
user intent / structured queries
L8
AGENT
ORCHESTRATION
Agentic Runtime & Multi-Agent Coordination
Query decomposition, tool selection, multi-step planning, ReAct loops, human-in-the-loop routing. The "brain" that decides what to do and in what order.
LangGraph CrewAI MCP / A2A DSPy agent-sdk (Rust)
Security overhead < 10ms / call 20+ threat vectors
tool calls / retrieval requests / LLM prompts
L7
RAG &
KNOWLEDGE
Retrieval, Knowledge Graphs & Verification
6-channel hybrid retrieval (Plugin, HNSW, BM25, Graph, Table Discovery, Ontology-Typed), 4-tier Knowledge Graph, Verify-then-Trust loop (DeepSeek → Z3 → Vadalog).
LAKEer FUSION Neo4j / Milvus PPR K=60 RRF Z3 / Vadalog
FACTS Grounding 77.7% Hallucination: 0.3%
verified context + token-budgeted prompt
L6
MODEL
LAYER
Foundation Models & Fine-Tuning
Decoder-only Transformers. Pre-training (next-token prediction) → SFT (instruction tuning) → Alignment (RLHF/DPO). Model-agnostic: swap models without changing the stack.
Llama 3.x DeepSeek Nemotron LoRA / QLoRA Claude / GPT-4o
Parameters 8B — 405B Multi-model concurrent
COMPILATION BOUNDARY
L5
INFERENCE
ENGINE
Serving Runtime & Scheduling
Continuous batching, PagedAttention, prefill/decode disaggregation, speculative decoding, KV cache management, tensor/pipeline parallelism across GPUs.
vLLM TensorRT-LLM Triton Server SGLang FlashAttention-3
P50 latency 87ms GPU util: 94%
optimized execution plan / fused kernels
L4
ML COMPILER
& GRAPH OPT
Compilation, Graph Optimization & Codegen
Hardware-agnostic passes (op fusion, CSE, dead code elim) → hardware-specific passes (tensor core mapping, tiling, memory coalescing). IR lowering from graph → loop nests → hardware instructions. Quantization-aware compilation (INT4/FP8 mixed precision).
MLIR / LLVM TVM XLA IREE TensorRT ONNX
Graph reduction 35-45% Op fusion + tiling
tiled kernels / DMA commands / instruction schedule
L3
RUNTIME
& DRIVERS
GPU/NPU Runtime, CUDA, Drivers
CUDA runtime, kernel launch, stream management, memory allocation (cudaMalloc / cuMem), NCCL collective operations, driver-level GPU scheduling, PCIe/NVLink DMA.
CUDA 12+ ROCm NCCL cuBLAS / cuDNN CUTLASS
Kernel launch ~5μs Stream concurrency
HARDWARE BOUNDARY
L2
INTERCONNECT
& MEMORY
NVLink, InfiniBand, HBM, Memory Hierarchy
Intra-node: NVLink (1.8 TB/s per NVL72 domain). Inter-node: InfiniBand NDR (400 Gb/s). Memory: HBM3e (8 TB/s bandwidth, 192GB/GPU on B200). NUMA topology, PCIe Gen5, CXL.
NVLink 5 NVSwitch IB NDR 400G HBM3e PCIe Gen5
NVLink BW 1.8 TB/s HBM: 8 TB/s
DMA transfers / memory-mapped I/O / RDMA
L1
GPU / NPU
ARCHITECTURE
Streaming Multiprocessors, Tensor Cores, Warps
B200: 192 SMs, 5th-gen Tensor Cores (FP4/FP8/INT8), 128 warps/SM, 32 threads/warp. Warp scheduling, register file (256KB/SM), shared memory (228KB/SM), L2 cache (96MB). Instruction pipeline: fetch → decode → schedule → execute → writeback.
B200 Blackwell H100 Hopper MI350X CDNA 4 Gaudi 3 Custom NPU / DSP
B200 FP4 20 PFLOPS 192 SMs, 192GB HBM
electrical signals / clock domains
L0
SILICON
Transistors, Process Nodes, Package
TSMC 4nm (B200), chiplet / multi-die packaging (2x Blackwell dies + Grace CPU), CoWoS (Chip-on-Wafer-on-Substrate) for HBM stacking, power delivery (1000W TDP), thermal management, billions of transistors switching at GHz frequencies.
TSMC 4nm 208B transistors CoWoS Chiplet / MCM 1000W TDP
Transistors 208 Billion Die: 2x 814mm²